Wafer Bonder for CMOS Image Sensors
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In response to market needs For 300mm process equipment capabilities to demonstrate 3D processes, SUSS MicroTec has introduced The XBC300. The XBC300 is designed for 3D integration and 3D packaging with through silicon vias (TSVs), and is ideal for the CMOS image sensor (CIS) early adopter market. The XBC300 is tailored to cover all 3D requirements by different process modules allowing for a combination of capabilities in a small package. The tool performs a range of wafer bonding processes in a small footprint. That, combined with high throughput capabilities reportedly optimizes cost-of-ownership (COO) for CIS applications. Process capabilities include 3D stacking with Cu-Cu that have smaller than 10um vias, fusion bonds including low-temperature processing for submicron overlay accuracy, force parallelism and uniformity ensures polymer confinement, and hybrid bonding of metal interconnects dielectrically isolated with either deposited oxide layers or adhesives. SUSS MicroTec, Waterbury VT, www.suss.com
Lead-free No-clean Die-attach Solder Paste
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Indium9.32 Die-attach Solder Paste is a halogen-free, no-clean, die-attach solder paste used in high-volume manufacturing for lead-free die-attach applications. Formulated to leave a benign, invisible residue, it is designed for reflow in forming gas. This product is said to have superior wetting capabilities, and offers trouble-free probe testing. Low voiding, as well as ultra-low residue makes it compatible with a variety of molding compounds. Indium9.32 reportedly meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore electromigration test criteria. Formulated to be applied using automated high-speed, high-reliability, single pointor multi-point dispensing equipment, it will also function in hand-held applications. Indium Corp. Utica, NY, www.indium.com
Polymer Resistor System
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LORD Corp. has developed the 8600 series as an alternative to ceramic high temperature materials (Cermet) for potentiometer applications due to its wear resistance. The polymer material is reportedly softer and offers extended life with reduced wear on the components. A low cure temperature attribute provides an alternative to the higher firing Cermet-based resistor systems. Each end member in the 8600 series is blendable with adjacent members to obtain intermediate resistance values. Further, it can be screen-printed onto a range of substrates including PCB, ceramics, glass, phenolic, and flexible substrates that are capable of withstanding the thermal processing requirements of the paste. The cured film is reportedly resistant to many solvents and is easy to use with good rheological properties. It can be used as a resistive coating for a variety of applications including tactile mouse control, or as die-attach adhesive for LEDs. Lord Corp. Cary, NC, www.lord.com
Inverted Materials Microscope
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The Eclipse MA200, from Nikon Instruments, is an inverted materials microscope designed for digital imaging and ergonomic efficiency. The MA200 uses integrated intelligence to automatically combine captured images with data on its observation settings for more comprehensive documentation. Additionally, its box design allows easy access to the sample on the stage and nosepiece, with a footprint that is 1/3 the size of the conventional model. Primary controls are set in front, to see and access the objective lens and sample easily, eliminating stress caused by long hours of operation.
The MA200 reportedly delivers bright, high-resolution and high-contrast images. The novel 1