Chip Foundry UMC Qualifies Unitive Technology
HSIN-CHU INDUSTRIAL PARK, TAIWAN
Taiwan-based foundry UMC has qualified the eutectic wafer bumping technology of Unitive Taiwan. In this partnership, Unitive is providing to UMC the technology and production capabilities for solder bumping, and Unitive’s expanded facilities in Taiwan will provide the capacity to meet UMC’s bumping requirements.
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