Cookson Electronics — Semiconductor Products Introduces No-Flow Underfill for Flip Chip Applications

ALPHARETTA, GA – July 9, 2002 — Cookson Electronics – Semiconductor Products has introduced STAYCHIPTM NUF-2076E, no-flow underfill used to perform the dual functions of a solder flux and an underfill between a flip-chip die and a substrate, or an area array device and a printed circuit board.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.