SUSS MicroTec Introduces Mask Aligner for 300 mm Packaging Applications at SEMICON West

SAN JOSE, Calif.- July 15, 2002-SUSS MicroTec today announced the MA300Plus, a full field proximity Mask Aligner addressing the growing demand for advanced packaging tools capable of processing wafers with diameters of up to 300 mm. The MA300Plus represents a new generation of Mask Aligners optimized for modern high-volume, high-end fabs, offering a throughput of more than 100 wafers per hour and high reliability, which translates into increased productivity and yield for back-end processing. The layout of the tool allows a very easy and fast switch between 200 mm and 300 mm wafer processing, making it the ideal bridge tool during the transition phase to the 300 mm wafer generation.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.