Dam and Fill Encapsulants
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Hysol FP4451TD and FP4800 high-purity dam and fill encapsulants meet the JEDEC level testing requirements for high-temperature reliability demanded by lead-free processes. Both enable smaller, thinner, and lighter wire-bonded, cavity-down SuperBGA and Viper BGA packages. Hysol FP4451TD delivers dam heights greater than 1 mm, with a tall dam flow control barrier recommended for package-level applications. It offers a 0.70 height-to-width aspect ratio. Hysol FP4800 is a liquid encapsulant that withstands solder temperatures up to 260ºC after JEDEC level 2 preconditioning. Its flow properties allow it to penetrate fine-pitch wires and deep cavities without entrapping voids. FP4800 self-levels for BGAs, PBGAs, CSPs, full arrays on LTCCs, transistors, SiPs, microprocessors, and ASICs. The Electronics Group of Henkel, Irvine, CA, electronics.henkel.com.
Viscosity Management Option
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An option for the Century Series Conformal Coating platform, the Viscosity Control System provides continuous viscosity management to maintain consistent delivery of temperature-responsive conformal coating fluids. It couples a heated recirculating fluid circuit with close-range temperature monitoring to keep the coating process consistent and stable. Solvent usage may be reduced, resulting in less VOC emissions. Fluid is continuously recirculated past strategically located temperature probes that control the temperature to within 1ºC. Safety is designed into the system by using components that meet stringent standards for use around volatile materials. Asymtek, Carlsbad, CA, www.asymtek.com.
Terminal Carrier Upgrade
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All Peel-A-Way Removable Terminal Carrier products, including PGA, DIP, SIP, and board-to-board connectors with lead-free terminal plating, are now RoHS-compliant. The Peel-A-Way polyimide film insulator, screw-machined terminals, and multi-fingered contacts passed survivability tests up to 260ºC for 40 seconds. For applications that require RoHS-compliant connectors, all Peel-A-Way products are offered with either matte-tin terminal plating with gold-plated contacts (MG) or traditional gold/gold plating (GG). Tin/lead plating will remain available for RoHS-exempt applications. Advanced Interconnections Corp., West Warwick, RI, www.advanced.com.
Probe Cards
The Vertical Spring (VS) Series probe cards feature crown-shaped probe tips, allowing for more reliable contact and minimal tip wear and probe marks. Since the crown tip provides four contact points between tip and bump, contact resistance is more stable. The new crown tips precisely position on the device under test (DUT) with accuracy and planarity, measuring any solder ball material. Individual probes and probe head units can easily be removed from the card and replaced, facilitating repair and making it more cost-effective. JEM America Corp., a subsidiary of Japan Electronic Materials Corp. (JEM), Fremont, CA, www.jemam.com.
Wafer-level Sealer
Suited for the emerging MEMS market, this automatic, high-volume, wafer-level sealer provides placement accuracy greater than ±0.002” and yields greater than 99%, each ensured by automatic lid placement and lid placement inspection. Special illumination and a programmable, heated stage allow sealing directly to metallized wafer surfaces using lids with a solder preform. Features include DSP power control of pulse parameters and precision, closed-loop controlled motion, and an internal network that integrates all control functions, including the Windows operator interface. Solid State Equipment Corp., Horsham, PA, www.ssecusa.com.