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In a slowing economy, everyone looks for signs of hope for a strong future. Unfortunately at times like these, funding for R&D often takes a back seat to the basic needs of a company to conduct commerce and basically stay in business by doing the same things in the same way just to keep pace. In fact, the real threat is that fear itself will force us into stagnation. And status quo is the true enemy. Courage is needed to be innovative in tough times.
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As we visit companies, we see the keys of success that feed creativity. At Freescale’s Technology Forum not only did they talk about how their products make things “smarter” with sensors and microprocessors, they also invited technology partners and university students to participate. Collaboration was key. At Unisem Group, many of the test handlers on the floor were there on consignment as a cooperative effort between supplier and customer. Everywhere, we see test labs in OEM facilities where customers regularly test out equipment or work together. Companies join consortia to bring stacked die with TSVs to market earlier. Interconnect now has more materials based on cost control issues than ever before, with Kulicke & Soffa introducing customer-supported methods to substitute copper for gold in wire bonding, and Henkel offering polymeric glue in place of silver alloy in paste. Green materials abound from the Occam process which eliminates solder paste, to the RCP package, to Unisem’s etched leadless package (ELP).
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Packaging will save the industry in many ways