Scalable Dispensing Platforms
The Spectrum S-920N Series of scalable dispensing platforms from Asymtek allows for system upgrade as user needs change. Rapid Response Heaters ramp quickly and deliver uniform heat across the entire part surface, while controlled process heat (CpH) can be added for increased automated heat control. The Spectrum S-920N’s patented non-contact jetting technology suits applications such as stacked-die underfill, chip scale package (CSP) underfill, and encapsulation of wire bonded packages. Asymtek, A Nordson Company Carlsbad, CA www.asymtek.com Booth #7857
Advanced Sputter Deposition System for Wafer Level Packaging
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The Apollo incorporates many standard features of NEXX sputter systems, and also offers higher power operation, longer target lifetimes, faster cycle times, and a faster robot. The Apollo has process flexibility, with production solutions for under bump metallization (UBM), redistribution layer (RDL), backside metal, integrated passives, 3D packaging, and LED. NEXX Systems, Inc. Billerica, MA, www.nexxsystems.com # 5633
High-frequency Center Probe Test Socket
Aries Electronics’ high-frequency center probe test socket was developed for manual, high-speed testing of devices with pitches as low as 0.40 mm. The socket’s solderless, pressure-mount, compression spring probes reportedly allow for easy mounting and removal from the test board. Four-point crown ensures ”scrub“ on solder balls for reliable contact mating, and its raised tip probe works with LGAs, MLFs, and other socket types. With an overall size of 30.48 mm