3D Packaging

Electromechanical Coating Processes
eG ViaCoat enables the metallization of TSVs, until now a process that was holding back adoption of 3D packaging. Performance allows for Cu seed layers to be deposited in 13:1 aspect ratio TSVs with reportedly significant reductions in cost of ownership compared to dry vacuum processes. Alchimer S.A. Massey, France, www.alchimer.com.

Flip Chip Package-in-Package
Flip Chip Package-in-Package (fcPiP) is a 3D package stacking solution from STATS ChipPAC that integrates the baseband, memory, and analog functions of a mobile communication device into a single package. The fcPiP combines flip chip and wire bond interconnection in the same package to deliver increased speed, performance and miniaturization. STATS ChipPAC, Techpoint, Singapore, www.statschippac.com.

Cleaning Chemistres

Stencil Cleaner
AQUANOX A4241, from Kyzen Corp. is an innovative product that is said to efficiently complete two processes. It was developed to clean populated circuit boards and stencils. This product has a revolutionary inhibitor package that will not damage the stencils and reportedly cleans even the toughest lead-free. Kyzen Corp. Nashville, TN, www.kyzen.com.

Cleaning Equipment

Batch Defluxing System
The Trident, from Aqueous Technologies, is capable of removing all flux residues including rosin, no-clean, and water soluble. Equipped with a chemical injection system that automatically adds a programmable volume of defluxing chemical to the wash water. It also dries and tests all in one unit. Additionally, the Trident is equipped with a closed-loop wash solution recycling system. Fewer chemicals are needed and nothing goes down the drain into the environment. Aqueous Technologies, Rancho Cucamonga CA, www.aqueoustech.com

Die-attach Equipment and Materials

Automatic Multichip Module Bonder
The latest generation large-area chip bonder from ASM Pacific Technologies Ltd., the MCM12, is said to address the growing market for MCM, SIP, and hybrid applications. It is a fully automatic, multiple die SMD and flip chip bonding system with up to 300-mm wafer handling capability. Direct die, flip chip, stack die, and SMD bonding can all be integrated into this single platform tool. It features a fully programmable dispensing system, and automatic pick-up and ejector tool changing systems. ASM Pacific Technologies Ltd. Hong Kong, www.asmpacific.com.

Wafer Backside Coating
Wafer Backside Coating (WBC) from Henkel is a specially designed adhesive applied to the back of a wafer. Conductive and non-conductive materials have been developed for smaller die sizes to enable package types such as COL, SOs, and packages with tight design tolerances that require controlled flow. The WBC process eliminates the need for the dispense step, saving time for the packaging assembly house. It also opens up the formulation window and maximum silver loading that can be achieved. Henkel Corp, Irvine, CA, www.ablestik.com.

Dispense/Encapsulation/Molding/Underfill Equipment and Materials

Encapsulation Tool
The new phase in encapsulation requires a machine that handle both liquid and solid encapsulant for the packaging of advance packages like high brightness LED and high I/O IC. IDEALcompress performs this task by combining compression and dispensing technology. The tool is able to encapsulate large format substrates, maximize asset usage, and achieves eco-friendly manufacturing due to the elimination of material waste. ASM Pacific Technologies Ltd. Hong Kong, www.asmpacific.com.

Epoxy Flux Material
Henkel’s breakthrough epoxy flux material, Hysol FF6000 combines flux functionality and underfill protection into a single material. A reflow curable material, Hysol FF6000 has been formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers underfill-like protection against mechanical stress. This in-line, one-step approach effectively eliminates the need for dispensing equipment and the time required for underfill application and cure. Henkel Corp., Irvine, CA, www.us.henkel.com.

Environmentally Friendly Materials

Batch Defluxing System
The Trident, from Aqueous Technologies, is capable of removing all flux residues including rosin, no-clean, and water soluble. Equipped with a chemical injection system that automatically adds a programmable volume of defluxing chemical to the wash water., it also dries and tests all in one unit. Additionally, the Trident is equipped with a closed-loop wash solution recycling system. Fewer chemicals are needed and nothing goes down the drain into the environment. Aqueous Technologies, Rancho Cucamonga CA, www.aqueoustech.com.

Solder Reclamation Service
FCT Assembly offers a unique and flexible user-friendly solder reclamation program to remove the burden from the customer. This environmentally friendly turnkey program complies with all federal, state, and provincial regulations. The service includes transportation documentation required for facilitating pickup, shipping, and processing of the reclaimable material, providing a cost efficient solution. FCT Assembly Greeley, CO, www.fctassembly.com.

Flip Chip Equipment and Materials

Multi Flip Chip Die Bonder
The Datacon 8800 CHAMEO dual-head multi-flip chip die bonder is designed to enable high volume, throughput, and precision performance for the completion of a multi-chip product in one production cycle. Two independent bond heads, flip units, slide fluxers and upward-looking cameras work in parallel and independently of each other to increase throughput, along with the strategy of short paths for architecture and flow control.

Other features include consistent, high-accuracy operation, wafer-handling capabilities, image-recognition system, and post-bond inspection. Datacon Technology GmbH, Radfeld, Austria, www.datacon.at.

Stencil Cleaner
AQUANOX A4241, from Kyzen Corp. is an innovative product that is said to efficiently complete two processes. It was developed to clean populated circuit boards and stencils. This product has a revolutionary inhibitor package that will not damage the stencils and reportedly cleans even the toughest lead-free. Kyzen Corp. Nashville, TN, www.kyzen.com.

Handling Equipment and Fixtures

Laser Cut Stencil
Slic Stencils incorporate a base material with a denser grain structure for fewer voids, smoother aperture walls, and the same tensile and yield strength as stainless steel. Results identified in an objective print study show significant improvements to the aperture wall smoothness which translates to enhanced printed deposits. The Slic Stencil has the mechanical and thermal properties of industry standard stainless steel, yet offers superior paste release due to the makeup of this proprietary material. FCT Assembly Greeley, CO, www.fctassembly.com.

Inspection Equipment and Services

Automated Optical Inspection
The MV-7L from Mirtec features advanced four (4) mega pixel digital color camera technology in an in-line AOI system. This technology yields absolute detection of lifted leads on gull wing devices and true coplanarity testing of BGA and CSP devices. An optional Intelli-Scan Laser System provides the ability to measure the Z-height of any given region of interest. A comprehensive package type library provides drag-and-drop component programming. Automatic teaching tool (ATT) software provides automatic teaching of component locations using CAD centroid data. Mirtec Kyunggi-Do, Korea, www.mirtec.com.

Macro Defect Inspection System
The NSX Inspection System from Rudolph Technologies, Inc. is a high-throughput, repeatable advanced macro defect inspection system that is able to detect defects as small as 0.5 µm. It is used primarily for applications in back-end semiconductor manufacturing processes which can have a major impact on OQA and yield. Thin-wafer handling, high-speed color image capture, and supermax illumination are three options for the NSX System that give customers the flexibility required to address a broad range of products and applications. Rudolph Technologies, Inc. Bloomington, MN, www.rudolphtech.com.

Novel Package Design

Wafer-level Camera Technology
OptiML WLC from Tessera Technologies enables a complete camera module in an ultra-small, low-profile form factor. Thousands of lenses can be built at wafer level simultaneously, providing more lenses per wafer to reduce manufacturing and development costs. The materials used for the optical elements enable assembly of the camera module to the phone board using typical IC manufacturing processes. The technology can scale from VGA to multi-mega pixel resolutions to help OEMs provide cost-effective product differentiation. Tessera Technologies, Inc. San Jose, CA, www.tessera.com.

Image Sensor Packaging Technology
Tessera’s SHELLCASE MVP wafer-level chip-scale package technology n is the company’s latest generation of its image sensor packaging technology. Using through silicon via technology (TSV), SHELLCASE MVP addresses market demand for more advanced technologies in image sensor packaging, including a thinner package, higher yield, enhanced reliability and lower cost. Tessera Technologies, Inc. San Jose, CA, www.tessera.com.

Package Design Software and Equipment

MEMS Simulation Environment
ARCHITECT with Scene3D from Coventor creates a rapid virtual prototyping environment for challenging MEMS and MEMS-enabled systems. This schematic-based MEMS design and simulation environment is used to determine the behavior of a MEMS device as a standalone component and in a surrounding system. At simulation speeds far beyond the capabilities of Finite Element Analysis, engineers can reportedly achieve more accurate “first-pass” designs, in less time. Coventor, Inc. Cary NC, www.coventor.com.

Reflow Equipment

Pure Convection Oven
The RO400FC is a pure convection oven allowing fast and homogenous heating. The implemented convection technology uses a vertical airflow for an efficient heating transfer making soldering of lead-free solder possible. The RO400FC provides full convection heating, along with an adjustable motor controlled chain conveyor. Measuring the zone temperatures in the convection airflow allows for reproducible results. The system features a SMEMA interface, and microprocessor control with predefined profiles. ESSEMTEC, Glassboro, NJ www.essemtec.com

Solder Reflow Oven
With 8-zone air or nitrogen models, 350