The HR65D-VI series of machine micro lenses (MMLs) has been designed for high-resolution discrete part inspection in semiconductor manufacturing operations including die bonding, flip chip bonding, chip on glass and chip on film machining. The C-mounted HR65D-VI series of MMLs are optimized for megapixel cameras up to 2/3-inch CCD chip size. Each HR65D-VI series lens includes a variable iris, providing the flexibility of adjusting and setting the depth of field. Incorporating integral coaxial telecentric lighting, the MMLs provide high resolution (3-13 micron, according to the camera pixel pitch) and high uniformity of illumination across the entire field of view. The MMLs are telecentric lenses, which maintain a constant view angle to the subject by keeping the optical ray paths parallel to each other. The MML is packaged in compact, low mass designs, assembled to endure the rigors of even the most demanding machine vision and industrial inspection applications. Moritex, San Jose, CA; www.moritexusa.com.