The TC-5121 thermally conductive compound is designed for mid-range electronic systems, such as desktop computers and graphic processing units. The new compound reportedly provides a formula less likely than other thermal materials to scratch heat-sink lids. The compound demonstrates a high level of thermal conductivity at 2.5 W/mK and a low level of thermal resistance at 0.1°C cm2/W. These properties enable better screen printing, lower bondline thickness, and easier application. Emerging markets for these thermal materials include light-emitting diodes, flat-panel displays and a variety of communication, and automotive products. Dow Corning Corp., Midland, MI, www.dowcorning.com.
