(May 15, 2006) Herndon, VA &#8212 The International Electronics Manufacturing Initiative (iNEMI) will hold a 2007 Roadmap workshop in Shanghai, China, in tandem with the High-density Microsystem Design and Packaging and Component Failure Analysis in Electronics Manufacturing (HDP) 2006 conference. Co-sponsored by HDP 2006, the Sino-Swedish Microsystem Integration Tech (SMIT) Center, and the IEEE Components, Packaging, and Manufacturing Technology Society (CPMT), the half-day workshop will take place June 27, 2006, on the Yan Chang Campus of Shanghai University.

(May 15, 2006) Research Triangle Park, NC &#8212 The third annual “3D Architectures for Semiconductor Integration and Packaging” conference, held by RTI International, will convene in San Francisco, CA, on October 31–November 2, 2006.