Freescale Orders SUSS Production Wafer-bonding System

Freescale added the MMA7261Q low-g X,Y, and Z accelerometer for consumer markets to its existing automotive inertial products offering. These MEMS sensors are tailored towards GPS systems, free-fall protection for disk drives, camcorder stability control, and gaming devices.

(May 26, 2006) Phoenix, AZ &#8212 Aiming to speed up development and deployment of 3-D wafer-level chip-scale packages (WLCSP) for integrated stack-die packages, FlipChip International (FCI) and Engent have formed a strategic alliance. FCI specializes in wafer-level bumping, while Engent’s focus is 3-D flip chip assembly.

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