To operate with minimal power consumption and high fidelity, the systems within the hearing aid require tight integration. Digital signal processing (DSP) enhances sound and speech intelligibility. Signal processing and wireless communication hardware will be the focus of AMIS’s project development for Interton. AMIS will concentrate research on power consumption and miniature size. The RF and signal processing subsystems will be packaged in a hybrid assembly.
(July 10, 2006) EDMONTON, Alberta — Micralyne, a MEMS components manufacturer, announced it has purchased SB6e wafer bonder and BA6 aligner systems from SUSS MicroTec, Inc. Micralyne invested in facility expansion and capital equipment due to increases in production at their plant.