SUSS MicroTec will also deliver a second vacuum probe system to IMEC, complementing the existing semiautomatic vacuum system currently in place for wafer-level reliability test of MEMS devices. A user places the device under test (DUT) in ultra-high vacuum environments that simulate actual operating conditions; therefore, the device can be tested before the packaging process to cut feedback time for R&D and costs.

(March 31, 2006) Phoenix, AZ &#8212 The second annual IMAPS Device Packaging Conference, March 20–23, drew double the audience of last year. Sessions were crowded, exhibit space was sold out, and excitement was high. The conference, which this year incorporated the former IMAPS Flip Chip Workshop, offered three keynote speakers and five parallel tracks, with 26 sessions totaling about 100 papers.