Compared to January’s reported $19.65 billion, February sales declined 2.2 percent sequentially; the SIA points out that February is historically a weak month for semiconductor sales. For a complete February data table, please click here.

IC packages are becoming more and more complex as time forges ahead; therefore, designing and building a cost-effective, robust product in a shrinking time-to-market window first poses challenges for the packaging industry. Most often, today’s packaging OEMs take on an incredible amount of risk and investment resources in the prototype stage. This white paper covers Henkel’s take on meeting such challenges through modeling and simulation software, along with testing and analysis performed by experts in packaging device materials science. To access the white paper, titled “Stress Free Modeling,” please click here.