(April 6, 2006) Research Triangle Park, NC — DuPont Semiconductor Packaging & Circuit Materials and the Fraunhofer Institute for Reliability and Microintegration IZM recently joined together in an applications development agreement, in which Fraunhofer will help to refine and optimize the processes of DuPont’s expanding wafer-level and chip scale packaging (CSP) materials portfolio.
(April 7, 2006) San Jose, CA — In 2005, a reported 116 billion ICs were produced worldwide in 2005, bringing the IC packaging market’s value to $23.1 billion, claims Electronic Trend Publications (ETP) in its latest report, The Worldwide IC Packaging Market — 2006 Edition. ETP reports that out of the 116 billion ICs, 37 billion were assembled by contract packaging companies, totaling $9 billion.