Toleno serves as Henkel’s Application Engineering Team Leader, in which he leads applications work for the company’s solder pastes, liquid fluxes, conformal coatings, pottings, surface mount adhesives, board level underfills, and thermally conductive adhesives. He actively participates in several industry organizations, including IMAPS, SMTA, and IPC, chairing several technical committees with these organizations. He has published numerous technical papers and articles for industry trade journals, and has written two chapters for electronic engineering handbooks on adhesives and materials.

(April 19, 2006) San Jose, CA &#8212 In March, and on a 3-month-average basis, North American-based semiconductor equipment manufacturers posted $1.35 billion in orders and a book-to-bill ratio of 1.04, according to SEMI’s March 2006 Book-to-Bill Report.