The SS-BGA324J-02-01 socket allows 1.0-mm-pitch, 23-mm-body, 22 × 22-array ICs to be used in socket and operate in high-bandwidth applications. The 10-GHz bandwidth sockets support dense-pitch BGA devices in a 500,000-actuations socket. Designed to dissipate up to 7 W without extra heatsinking, SS-BGA324J-02-01 handles up to 60 W with a custom heatsink. Typical contact resistance is 30 mΩ per 4-A ball. A 16-mm-diameter hole in the middle of the compression assembly accesses silicon to test temperature by using a focused ion beam, or by placing a thermocouple. Operating temperature range is -40° to 150°C to test over burn-in and high-temperature test applications. Pin inductance is 1.3 nH, and mutual inductance is 0.62 nH. Capacitance to ground is 0.45 pF, while pin-to-pin capacitance is 0.0425 pF. The socket’s footprint requires a 2.5-mm border around the IC, and features a clamshell lid with actuation to press the chip onto the spring pins in the socket. Ironwood Electronics, Eagan, MN, www.ironwoodelectronics.com.