Nano Spray technology achieves conformal coating of extreme surface topographies, demonstrating conformal coatings of vertical via walls 300-µm deep and 100-µm in diameter. This enables further lithography steps in the bottom of the via to create through-wafer interconnects. To meet further challenges of advanced packaging and interconnect markets, the Nano Spray nozzle enables refined dispense and targeted positioning of the spray stream. EV Group, St. Florian, Austria, www.evgroup.com.