(July 24, 2006) BLAUBEUREN, Germany — Centrotherm has combined their vacuum soldering technology with low-pressure plasma processing to produce plasma-supported reflow-solder in their VLO vacuum furnaces. The series includes a vacuum batch oven with chamber volumes from 20 to 300 litres, usable with low-pressure plasma for a variety of speciality soldering processes. The ovens are designed for ultra-clean void-less vacuum soldering for ultra-fine-pitch connections on inorganic substrates.