A high-brightness, surface-mount 1-watt LED in a energy-efficient package, this miniature device has a thermal resistance of 2°C/watt. Janie Haynie, product marketing director, Visible LEDs, OPTEK, credits the packaging of the device for its thermal resistance. The packaging allows the heat to come out of the leads as well as out of the bottom of the cup, directly into the substrate. It is also designed to mount onto a metal core substrate without additional underfill or adhesives.
(June 21, 2006) PETALUMA, CA —Tegal Corp announced that a global leader in wafer-level packaging (WLP) purchased its Endeavor AT PVD cluster tool for under-bump metallization (UBM). Sputtered Films, a subsidiary of Tegal, received the order. The cluster tool is reportedly the fifth of its kind this customer has ordered.