IMAPS Consolidates ITRS and iNEMI Roadmaps

(August 9, 2006) WASHINGTON &#151 The International Microelectronics and Packaging Society (IMAPS) Global Business Council (GBC) will undertake a project to interpret industry roadmaps’ coverage of semiconductor packaging challenges. IMAPS began a study of two widely-used industry roadmaps &#151 the International Technology Roadmap for Semiconductors (ITRS) and the roadmap of the International Electronics Manufacturing Initiative (iNEMI) &#151 after discussions at IMAPS GBC workshops, and with their National Technical Committee (NTC). The ITRS offers technical chip-level assessments, while iNEMI addresses upcoming high-level integration requirements. Both roadmaps intersect on the topic of packaging, but it only represents a small portion in each, said Laurie Roth, co-chair, IMAPS GBC.

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