IBM unveils next-gen lead-free packaging technique

As part of the technology and licensing deal, SUSS MicroTec will develop a complete line of 300-mm and 200-mm equipment to enable commercialization of IBM’s C4NP (Controlled Collapse Chip Connection New Process), which is a flip chip technology offering the combined advantages of lead-free, high reliability, fine pitch, lower material cost, as well as the flexibility to use virtually all types of solder compositions. IBM will continue advanced research and process optimization of C4NP and offer on-site process training to customers who purchase commercial systems from SUSS.

(September 14, 2004) Taipei, Taiwan&#8212The semiconductor equipment market is taking a “temporary pause,” but is still “fundamentally strong,” according to yesterday’s speakers at SEMICON Taiwan 2004. Prominent leaders in the semiconductor equipment industry participated in a panel discussion on the opening day of the conference.

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