The company’s new line uses its totally inkless process based on an advanced wafer mapping program that electronically merges bump maps, electrical sort maps and vision inspection maps for all formats into one composite map that controls the selection and taping of all devices. This inkless electronic mapping process, according to the company, eliminates unnecessary manufacturing operations, increases the quality level and throughput by 400 percent. The line also features a ‘punch-through’ tape that allows customers to remove die from either side of the finished tape.

(May 10, 2004) Santa Clara, Calif.&#8212Hestia Technologies Inc. has received U.S. Patent No. 6,667,439, titled ‘Integrated Circuit Package Including Opening Exposing Portion of an IC,’ for its technology presently used in volume manufacturing of fingerprint touch sensor packages with an exposed portion of the die.