The primary competitive focus for electronic polymers used in PCB laminates and packaging will be the continuing replacement of wire-bonded packages by flip chip and other types of area array and chip scale packaging (CSP) in many applications, according to the study. Standard wire bonded packages are expected to continue to predominate, but the move to area array packaging will cause significant shifts in material requirements as formerly niche materials become major segments of the industry. Chip underfills used in flip chip assemblies, for example, are expected to see annual growth of nearly 30 percent per year through 2008.

(May 14, 2004) Washington, D.C.&#8212The International Microelectronic and Packaging Society (IMAPS) and the American Ceramic Society (ACerS) have announced an agreement to jointly sponsor The International Conference on