(November 29, 2005) Jersey City, NJ — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design and ordering software, effective August 30, 2005. Their “System and Method for Modifying Electronic Design Data” patent covers the part of the software that allows unique or custom stencil design rules to be electronically programmed into the system and then automatically applied to any standard stencil data file, creating a new data file that is used to produce the stencil.