SEMICON WEST JULY 16 EVENTS

8:00 a.m.-5:00 p.m.
Semiconductor Processing Technology (Day 2)
San Jose Marriott Hotel, San Jose

Bond Tester
Designed to meet the demands of testing ultra-fine-pitch wire-bonded devices, the Series 5000 Bondtester is said to be capable of testing bonds at pitches of 50 micron and below. An advance from the company’s Series 4000 Bondtester, the upgraded model reportedly includes numerous advantages, including optical systems to help operators align and grade the bonds, ultra-low force transducer systems and shear-and-pull tooling to minimize lead and ball damage.
Dage Precision Industries Inc.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.