SAN JOSE, CALIF.
Asymtek was recently awarded seven patents related to underfill dispensing and conformal coating: Vacuum Assist Underfill Design Applications (#D466, 140) Vacuum Assist Underfill Multi-Plenum L Tool and U-Tool (#D473,883 & D474,214) Flip Chip and Underfill System & Methods (#3,280,385 & 6,541,304) Fan Width Control module for conformal coating units (#6,457,655 B1) and No-Flow Underfill Profiling of a Dot (#6,234,379)

Wafer Probing System
The double-sided, Backside wafer probe system is said to be less destructive than typical wafer probers because engineers can access the test site directly from either side of the wafer. Additionally, the system is designed to probe both the back- and front-side of the wafer – simultaneously if necessary. The 8000 Series probe station is for 200 mm wafers and the 9000 Series is for 300 mm wafers to be used as the base for the double-sided backside system. The backside probing capability reportedly opens a new view seen through the station microscope. The front side is viewed with a camera mounted on the standard prober X-Y stage. The wafer front also may be probed with a probe card that is attached to the station platen.
The Micromanipulator Co.