ASAT to provide flip chip technology to Shanghai Fudan Microelectronics

(January 20, 2004) Pleasanton, Calif.&#8212ASAT Holdings Ltd. and ASAT Inc., global providers of semiconductor package design, assembly and test, will provide flip chip land grid array (LGA) technology to Shanghai Fudan Microelectronics Co. Ltd. (Hong Kong, China) for multimedia applications.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.