Semico believes the transition to 130-nm and smaller process technologies will accelerate as the recovery takes hold and new products are introduced. In 2003, 16 percent of all wafers were processed using 130-nm and smaller process technology. In 2004, 31 percent of the total IC wafers manufactured will use 130-nm process technology or smaller. This equates to almost 23 million wafers out of a total of 74 million used in the production of all ICs, excluding discretes and bipolar.

(March 01, 2004) Phoenix, Ariz.&#8212FlipChip International LLC, which operates a wafer-scale packaging and bumping business, has appointed Jack Hodgson as its chief financial officer (CFO).