SEMI publishes six new technical standards

SEMI Standards are published three times a year. The new standards, which are part of the November 2004 publication cycle, join more than 685 standards that have been published by SEMI during the past 31 years.

Included in the new standards are specifications for liquid carbon dioxide cleaning, test methods for RF output power for wafer processing systems, micro identification marking for 300-mm wafers, and procedures for improving device traceability.

(October 5, 2004) Singapore and Fremont, Calif.&#8212STATS ChipPAC announces reaching a milestone in its scale-up of full turnkey wafer-level chip scale package (WLCSP) wafer bumping, probe, and back-end processing services, with production run rates exceeding four million packaged units per month.

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