3-D chip scale packaging refers to the vertical (Z-axis) stacking of multiple die within a package, or multiple packages, using specialized substrates and interconnects. Earlier advanced IC packaging solutions such as ball grid arrays (BGAs) and CSPs have succeeded in decreasing package sizes while increasing I/O count and overall component performance, but their capabilities are falling short in today’s more mobile-oriented technology landscape.

(June 1, 2004) Irvine, Calif.&#8212Newport Corp. has signed a definitive agreement with Thermo Electron Corp. to purchase Spectra-Physics for $300 million, subject to a post-closing net asset adjustment. Spectra-Physics represents substantially all of the optical technologies business of Thermo Electron. The purchase price is comprised of $200 million in cash, $50 million in Newport Corp. common stock, and a $50 million promissory note bearing 5% interest and payable in 2009. The transaction is subject to regulatory approval as well as other customary closing conditions, and is expected to close in July 2004.