The Test, Assembly and Packaging Suppliers Forum offers attendees the opportunity to view presentations and learn the capabilities of industry suppliers including:
* Agilent Technologies
* KYEC
* LogicVision
* Pintail Technologies
* Sonoscan, Inc.
* UTAC America, Inc.
(June 22, 2004) Herndon, Va.—The National Electronics Manufacturing Initiative’s (NEMI’s) Component and Board Marking Project recently made recommendations for the identification of electronic components and board assemblies that have been modified for use in lead-free assembly processes. The team has also identified standard vocabulary terms to create a common terminology related to lead-free processing.