Leo M. Higgins III, PhD, ASAT’s director of field applications engineering, will present a paper titled Stress Reduction in Copper — Low K Flip Chip Packaging for Reliability Enhancement. For further information, visit www.asat.com.
Leo M. Higgins III, PhD, ASAT’s director of field applications engineering, will present a paper titled Stress Reduction in Copper — Low K Flip Chip Packaging for Reliability Enhancement. For further information, visit www.asat.com.
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