Wafer-level packaging…whose job is it anyway?

As wafer-level processing and package assembly continue to converge and the lines between front-end and back-end blur, many questions arise. One of the most important questions is, “Where will wafer-level packaging take place?” That is among the topics of the next MicroElectronics Packaging and Test Engineering Council (MEPTEC) 1-day technical symposium coming up on August 19th in Santa Clara, CA. MEPTEC will bring together experts from various areas of the wafer-level packaging/processing fields to help answer that and other questions related to wafer-level packaging.

Calling all industry experts! Every year, Advanced Packaging has a few new things to add to the editorial calendar of upcoming features. In January 2005, we will feature a forecast of the year to come. Though 2004 has been a wonderful year of recovery in electronics, everyone seems to wonder if 2005 and 2006 will flatten a bit or stay the current course.

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