A report discussing these research results first appeared in the July 25, 2004 issue of the journal Nature Materials. Its co-authors are Peidong Yang, a professor with UC Berkeley’s chemistry department; Yanfeng Zhang, Donald Sirbuly and Jonathan Denlinger of Berkeley Lab; and Tevye Kuykendall, Peter Pauzauskie and Joshua Goldberger of UC Berkeley.

(August 16, 2004) San Jose, Calif.&#8212LogicVision, Inc., a provider of embedded yield enhancement solutions for integrated circuits, announced today that it has aligned with UMC to provide the foundry’s customers with access to its wafer yield solution. This LogicVision product aims to develop increasingly higher wafer yields at 90 nm and below process geometries.

The goal of the LogicVision-UMC partnership is to provide solutions that facilitate both faster time-to-market and faster time-to-yield. LogicVision’s representative in Taiwan, Spirox, will provide local direct support to this project.