Non-Profit Group Promotes WLCSP in Consumer Products

SAN JOSE, CA (November 3, 2006)&#151 The Wafer Level Chip Scale Package Forum, a non-profit group focused on promoting the adoption of wafer-level chip-scale packages (WLCSP) semiconductor devices in consumer electronics products, met for the first time this week in San Jose to discuss WLCSP issues, and to establish industry sponsored “best practices” for their use. Working groups were formed to survey OEM manufacturers as to the barriers to WLCSP adoption, and to attract new members from the supply chain of designers, marketers, manufacturers, and suppliers.

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