General co-chairs, Samuel J. Horowitz and David Wilcox, have announced the finalizing of the technical program and have highlighted important aspects of the event, including the participation of speakers from 13 different countries in Europe, Asia, and the Americas, reflecting the international scope of the three-day conference. Six invited keynote speakers will provide comprehensive overviews of current and future directions in key areas, including: ceramic microsystems, ceramic interconnect, materials and processing, automotive applications, and design and integration. Additionally, 57 contributed papers in 15 different sessions will address the latest advances in ceramic interconnect and ceramic microsystems.
(January 18, 2005) Singapore and Fremont, Calif. — STATS ChipPAC Ltd. has earned the Asset Triple A Best High-Yield Bond for Asia, for STATS ChipPAC’s US$215 million issue due 2011. The award is part of the annual selection of the best capital market deals published in the December 2004 issue of The Asset, an Asian finance magazine.