STATS ChipPAC Develops Strip-testing Capabilities for Devices

Testing multiple devices simultaneously in a strip format has been predominantly used in the industry to achieve lower costs for small-outline, low-pin-count devices that have relatively simple test requirements.

(March 10, 2005) Santa Clara, Calif. &#8212 National Semiconductor (NSC) announces that it is seeking a buyer for its assembly and test plant in Toa Payoh, Singapore. The move is a part of the ongoing restructuring of the company to focus its activities on higher-value-add analog ICs, and to reduce its exposure to commodity linear and digital markets. In January, the company announced layoffs of 550 people as an effort to restructure.

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