(December 20, 2006) CHANDLER, AZ — Amkor Technology, Inc., signed a licensing agreement for Advanced Micro Devices (AMD) to use its lead-free electroplated wafer-bumping technology. Terms remain undisclosed.
(December 20, 2006) CHANDLER, AZ — Amkor Technology, Inc., signed a licensing agreement for Advanced Micro Devices (AMD) to use its lead-free electroplated wafer-bumping technology. Terms remain undisclosed.
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