HSIN-CHU, Taiwan — Nov. 20, 2000 — Taiwan Semiconductor Manufacturing Company, one of the world’s largest dedicated semiconductor foundries, has begun producing its first 300 mm customer product wafers.

Product designs from several customers including Altera Corporation and Brilliance Semiconductor, Inc. were started in early November, according to company officials. Altera, a PLD supplier, and BSI, a Taiwan-based SRAM supplier for portable applications, are among the companies expected to have their designs produced on 300 mm wafers during the fourth quarter. Following evaluation and testing of the initial production wafers, ramp-up is expected to begin.

TSMC officials also reiterated their commitment to 300 mm manufacturing.

“As we have said many times before, TSMC is committed to being the industry leader in technology, at every technical node,” said TSMC President F.C. Tseng. “The move to 300 mm manufacturing opens up more room for improvement, ultimately resulting in higher yields, higher volumes and higher product quality for our customers.”

TSMC’s Fab 6 was opened last March. The company’s Fab 12, one of two lines that will be dedicated to 300 mm manufacturing, is currently under construction in the Hsin-Chu Science-Based Industrial Park.

–Jeff VanPelt