UMC’s 300mm Project Gets Support From Singapore’s EDB

TAIWAN — The investment arm of the Singapore Economic Development Board – EDB Investments Pte. Ltd. (EBDI) – has been added as a 15 percent shareholder to the United Microelectronics Corp. advanced 300mm fab project in Singapore’s Pasir Ris Wafer Fab Park.

“This strategic partnership will propel Singapore into the next phase of advanced semiconductor fabrication and help us to remain at the forefront of technology,” said Liow Voon Kheong, general manager of EBDI. “This number and types of jobs to be created, extent of knowledge transfer, and the numerous other economic spin-offs from this venture will significantly add to the existing solid infrastructure of more than a dozen advanced semiconductor wafer fab projects in Singapore.”

The fab will be built in two phases, with a planned capacity of 40,000 wafers per month. Ground is expected to be broken later this quarter, and officials hope to begin moving equipment in 2002.

EBDI joins Infineon Technologies AG, which has a minority stake in the $3.6 billion project.

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