DRESDEN, Germany – A 2,600-square-foot cleanroom, previously occupied by Infineon, is the new site of research and development of emerging wafer-lithography technologies being conducted by Fraunhofer Center for Nanoelectronic Technologies (CNT; www.fraunhofer.de).
CNT is a public/private partnership involving Infineon Technologies AG, Advanced Micro Devices (AMD) and other research partners, established to rapidly transfer emerging and discrete process solutions for the fabrication of nanoelectronic systems on 300 mm wafers into the industrial manufacturing environment. Research will involve institutes as well as material and system manufacturers.
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Leica Microsystems’ (www.leica-microsystems.com) SB3851 DW electron-beam system (see photo), which will be used for selected processes in the development of high-density storage devices and high-performance transistors, is a recent technology incorporated into the CNT cleanroom. The Leica technology uses a variable-shape beam to enable high-precision direct-write patterning down to the 45 nm feature size. The system is designed to meet the requirements for the 65 nm node in 300 mm wafer lithography.