NEWPORT, Wales–Designed for 200-mm semiconductor processes, Trikon Technologies (www.trikon.com) began shipments in April for its Omega i2L dry-etch system, which combines the company’s inline cassette-to-cassette handling subsystem with Windows NT control software and process modules from the company’s fxP series cluster tools.

Trikon says it is hopeful its contamination-control technology will surpass the performance of competing semiconductor technologies for what it calls “mainstream silicon” applications-robust processes for technology nodes greater than 100 nm that can be quickly ramped to profitable production.

“We have produced a significant tool for mainstream silicon applications without the usual risks associated with developing a new tool for semiconductor manufacturing,” claims Trikon CEO Dr. John MacNeil. “The 200-mm tools going into China’s new fabs must provide the simplicity and cost-effectiveness needed to ramp the country’s semiconductor industry. These tools must also be adaptable and cannot limit process capability or migration to the next technology-this is exactly what the Omega i2L is designed to do.”

The system is designed to be configured with up to two process modules for wafers of up to 200-mm. Trikon says Omega i2L is also applicable to MEMS and wafer-level packaging. Its interferometeric endpoint detection system is designed to significantly improve device yield and reduce scrap.

Trikon says its system, which is adaptable to 50-mm to 200-mm multiwafer types, can be installed through-wall or as a stand-alone in a ballroom cleanroom. III