July 19, 2006 — /EV GROUP/ — EV Group (EVG), based in St. Florian/Inn, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system.
As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and process expertise to this growing problem. Likewise, Brewer Science brings 25 years of advanced materials expertise gained as a supplier of polymeric coatings to the microelectronics industry. The two companies are combining their experience and knowledge to create a complete ultrathin wafer handling solution for semiconductor companies that need to perform wafer thinning and high-temperature advanced packaging processes, followed by quick debonding. End users in the industry are currently evaluating solutions.
EVG’s EVG (r) 850 Temporary Bonding platform is already the industry standard for temporary bonding solutions. It is used extensively in low-temperature post-processing applications in the compound semiconductor and power device markets. This extension of the product line into tackling one of the mainline semiconductor industry’s technical hurdles is a natural progression for the system.
“EVG sees the collaboration with Brewer Science as an important step towards meeting the customer expectation that we are a total solution provider. It is no longer possible to only supply the equipment or the material. It is up to organizations like Brewer Science and EVG to work together to tackle the industry challenges and to provide the full solution to our customers, so that we may all be successful,” says Erich Thallner, CEO and Founder of EVG.
About Brewer Science
About Brewer Science: Brewer Science, a multidivisional technology company, has pioneered industry-enabling innovations from ARC® anti-reflective coatings to ProTEK(tm) etch protective coatings. Following on its long tradition of being first to introduce and implement cutting-edge technologies, Brewer Science is proud to introduce WaferBOND(tm) temporary wafer bond coatings. Brewer Science is a major producer of high-quality materials, processes and machine solutions that meet the stringent requirements of today’s IC, compound semiconductor, MEMS, and optoelectronic industries. Under the leadership of Dr. Terry Brewer, president and founder, Brewer Science continues to develop innovative technologies, reliable products, and responsive services, each attuned to the specific needs of individual customers. Further information on the technology and product information from Brewer Science can be obtained via the company’s website at www.brewerscience.com.
Contact:
James Lamb
Brewer Science, Inc.
2401 Brewer Drive
Rolla, Missouri 65401, USA
Phone: +1 573 364 0300
Fax: 573 458 4372
[email protected]
About EV Group
Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). The company’s unique Triple I approach (Invent – Innovate – Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit www.EVGroup.com.
Contact:
Steven Dwyer
EV Group Inc.
7700 South River Parkway
Tempe, AZ 85284
Phone: +1 480 727 9600
Fax: +1 480 727 9700
[email protected]