ChipPac opens R&D center at new site

ChipPac opens R&D center at new site

Santa Clara, CA

ChipPac, an IC assembly and testing company, is opening a research and development center dedicated to flip chip technology at its corporate headquarters in Santa Clara, CA. Approximately one-sixth of the 30,000-square-foot site comprises the flip chip R&D center, which officials claim will allow the company to support a thriving market. According to industry analysts, the flip chip packaging segment is expected to grow from a reported 475 million units in 1996 to an estimated 2.5 billion units in 2004.–TGW

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