SelectConnect creates 3D electromechanical molded interconnect devices

September 1, 2011 – PRWEB — Laser direct structuring (LDS) technology provider SelectConnect Technologies introduced 3D design capabilities to create electromechanical functionality on molded interconnect devices (MID).

LDS allows more complex geometric 3D designs. Electromechanical circuits are produced on molded thermoplastic components for antenna used for cellular, GPS, Wi-Fi, Bluetooth and ISM band applications, automotive sensors, medical devices, RFID, and security housings.

SelectConnect acquired an LPKF Microline 160 3D laser system, which transfers the electromechanical design from a CAD data file directly onto a molded thermoplastic component or into a device structure. The circuit traces are embedded onto the thermoplastic component by the laser. Then electrical pathways and landings are electroless plated using the patented SelectConnect process for metallizing circuits on molded components. Surface mount components can then be attached using reflow soldering or wire bonding.

The LDS capability shortens time-to-market and easily incorporates design changes during prototyping. Changes are quickly made to the CAD file and uploaded to the laser. Parts are then etched and metalized. In many instances, new parts are ready for testing the next day.

SelectConnect Technologies, a division of Arlington Plating Company, provides LPKF’s LDS process. SelectConnect Technologies is ISO 9001 and ITAR registered. Visit http://www.selectconnecttech.com.

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