Nextreme Thermal raises $8 million

Feb. 10, 2005 — Nextreme Thermal Solutions, a Research Triangle Park, N.C., developer of next generation thin-film superlattice thermoelectric devices for applications that require extreme thermal management, raised $8 million in a Series A round of funding, according to a news release.

The investor syndicate was led by Spacevest and Aurora Funds and included Harris & Harris Group and RTI International.

Nextreme says its superlattice material, when placed directly under a hot spot, can efficiently pump heat out of a semiconductor package. The company furthermore says the formfactor of the device enables direct integration onto semiconductor silicon or into a chip package, providing a solid-state solution with no moving parts.

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