Dec. 15, 2005 — Semitool Inc., a Kalispell, Mont., supplier of wafer processing equipment, announced the installation of its third Raider platform at CEA Leti Nanotec in Grenoble, France.
The company said the single-wafer system will allow CEA Leti to develop and deploy 45nm and 32nm processes for copper interconnect-related applications on 300mm wafers using the latest Semitool electrochemical deposition system.
Semitool previously supplied two Raider systems to CEA Leti, one of which is an advanced front-end of line cleaning system for 200mm and 300mm wafers, and the other a plating system for copper interconnects.