Oct. 9, 2006 — Alcatel Micro Machining Systems, an Annecy, France, supplier of deep silicon etching equipment (DRIE) for MEMS and 3D Semiconductors, announced that it has received a multi-million dollar order from Xintec Inc. in Taiwan for its new AMS 200 “I-Productivity” production tool for advanced Wafer Level Chip Size Packaging (WLCSP) technology.

Xintec, which is manufacturing high quality IC Packaging products, selected the Alcatel AMS 200 “I-Productivity” for multiple applications including a unique glass-silicon sandwich packages delivering superior optical performance for CMOS image sensors.

The new Alcatel AMS 200 “I-Productivity” DRIE tool was introduced in April 2006. The optimization of the Bosch process parameters have shown ultra high Silicon Etch Rate up to 32 micrometers per minute, lower etch drift, extended cleaning frequency, limited edge exclusion with unrivaled uniformity and repeatability leading to excellent process yields.

Alcatel Micro Machining Systems (AMMS) is a subsidiary of Alcatel Vacuum Technology France located in Annecy, France. AMMS is specialized in designing, manufacturing, marketing and servicing deep plasma etching systems ( DRIE ) for the fabrication of Micro Electro Mechanical Systems and 3D Semiconductors. Its main application markets are the telecommunications, automotive, aerospace, computer peripherals, biomedical industries, power devices and wafer level packaging.

Xintec Inc.’s principal activities are provision of advanced Wafer-Level Chip Size Packaging (CSP) technology and other wafer extended process. Products include unique glass-silicon sandwich packages delivering superior optical performance for CMOS and CCD image sensors. The company exports its products to Asia, Europe, North America and other countries.